With the rapid development of the computing power industry and the continuous rise in the thermal design power (TDP) of chips, the “thermal wall” has become a key bottleneck constraining the upgrading of the global computing power industry. For a long time, China has been highly dependent on imported high-end thermal management materials, and issues regarding thermal conductivity efficiency and cost have directly impacted the level of self-reliance and control over computing infrastructure. Overcoming the technical challenges of extreme heat pipe technology, developing advanced thermal management materials with higher performance, and establishing a self-reliant and controllable thermal management materials supply chain are of significant strategic importance for ensuring the security of China’s computing industry and enhancing its core competitiveness.
Recently, the high-thermal-conductivity diamond/copper heat sink modules developed by the team were successfully integrated into the C8000 V3.0, the world’s first megawatt-class phase-change immersion liquid cooling rack-scale solution. This integration enhances the heat transfer capacity of chip modules by 80% and boosts chip performance by 10%.
According to the announcement, the product has been deployed in a cluster at the National Supercomputing Internet Core Node Major Science and Technology Platform (Zhengzhou, Sugon Scale), marking the world’s first large-scale application of diamond/copper high-thermal-conductivity composite materials in the thermal management of computing chips.
This achievement validates the material’s reliability under extreme heat flux density conditions, opens up a new technical pathway for packaging and thermal management of domestically produced computing chips, and holds significant strategic importance for ensuring the security and competitiveness of China’s computing industry.